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F. Chen, et al., “Investigation of emerging middle-of-line poly gate-to-diffusion contact reliability issues”, in Reliability Physics Symposium (IRPS), 2012 IEEE International, 2012, p. 6A.4.1 -6A.4.9.
Li, Di-an and M. Marek-Sadowska, “Variation-aware electromigration analysis of power/ground networks”, in Computer-Aided Design (ICCAD), 2011 IEEE/ACM International Conference on, 2011, p. 571 -576.
Li, Di-an, M. Marek-Sadowska, and B. Lee, “On-chip em-sensitive interconnect structures”, in SLIP '10: Proceedings of the 12th ACM/IEEE international workshop on System level interconnect prediction, 2010, p. 43–50.