Publications

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Filters: Keyword is copper contact and Author is Anderson, B.  [Clear All Filters]
Conference Paper
F. Chen, Mittl, S., Shinosky, M., Swift, A., Kontra, R., Anderson, B., Aitken, J., Wang, Y., Kinser, E., Kumar, M., Wang, Y., Kane, T., Feng, K. D., Henson, W. K., Mocuta, D., and Li, Di-an, “Investigation of emerging middle-of-line poly gate-to-diffusion contact reliability issues”, in Reliability Physics Symposium (IRPS), 2012 IEEE International, 2012, pp. 6A.4.1 -6A.4.9.