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Conference Paper
F. Chen, Mittl, S., Shinosky, M., Swift, A., Kontra, R., Anderson, B., Aitken, J., Wang, Y., Kinser, E., Kumar, M., Wang, Y., Kane, T., Feng, K. D., Henson, W. K., Mocuta, D., and Li, Di-an, Investigation of emerging middle-of-line poly gate-to-diffusion contact reliability issues, in Reliability Physics Symposium (IRPS), 2012 IEEE International, 2012, pp. 6A.4.1 -6A.4.9.
Li, Di-an, Marek-Sadowska, M., and Lee, B., On-chip em-sensitive interconnect structures, in SLIP '10: Proceedings of the 12th ACM/IEEE international workshop on System level interconnect prediction, 2010, pp. 43–50.
Li, Di-an and Marek-Sadowska, M., Variation-aware electromigration analysis of power/ground networks, in Computer-Aided Design (ICCAD), 2011 IEEE/ACM International Conference on, 2011, pp. 571 -576.