Publications

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Filters: Author is Yanfeng Wang and Keyword is copper contact  [Clear All Filters]
2012
F. Chen, Mittl, S., Shinosky, M., Swift, A., Kontra, R., Anderson, B., Aitken, J., Wang, Y., Kinser, E., Kumar, M., Wang, Y., Kane, T., Feng, K. D., Henson, W. K., Mocuta, D., and Li, Di-an, “Investigation of emerging middle-of-line poly gate-to-diffusion contact reliability issues”, in Reliability Physics Symposium (IRPS), 2012 IEEE International, 2012, pp. 6A.4.1 -6A.4.9.