Publications

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F. Chen, Mittl, S., Shinosky, M., Swift, A., Kontra, R., Anderson, B., Aitken, J., Wang, Y., Kinser, E., Kumar, M., Wang, Y., Kane, T., Feng, K. D., Henson, W. K., Mocuta, D., and Li, Di-an, “Investigation of emerging middle-of-line poly gate-to-diffusion contact reliability issues”, in Reliability Physics Symposium (IRPS), 2012 IEEE International, 2012, pp. 6A.4.1 -6A.4.9.
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Li, Di-an, Marek-Sadowska, M., and Lee, B., “On-chip em-sensitive interconnect structures”, in SLIP '10: Proceedings of the 12th ACM/IEEE international workshop on System level interconnect prediction, 2010, pp. 43–50.
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Li, Di-an and Marek-Sadowska, M., “Variation-aware electromigration analysis of power/ground networks”, in Computer-Aided Design (ICCAD), 2011 IEEE/ACM International Conference on, 2011, pp. 571 -576.