Publications

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Filters: Keyword is copper contact and Author is Yanfeng Wang  [Clear All Filters]
2012
F. Chen, Mittl, S., Shinosky, M., Swift, A., Kontra, R., Anderson, B., Aitken, J., Wang, Y., Kinser, E., Kumar, M., Wang, Y., Kane, T., Feng, K. D., Henson, W. K., Mocuta, D., and Li, Di-an, “Investigation of emerging middle-of-line poly gate-to-diffusion contact reliability issues”, in Reliability Physics Symposium (IRPS), 2012 IEEE International, 2012, pp. 6A.4.1 -6A.4.9.